Every new generation of electronic products integrates smaller dimensions with advanced technical abilities. This results in unavoidable heat generation because the electrical resistance of the products is focused on smaller and smaller areas. If heat is not efficiently managed, these spots can become increasingly hot.
Heat dissipation materials that were formerly used, such as metals like copper combined with a smart airflow or even water-cooling systems, are not as easily applied because of the small dimensions of electronic products.
Researchers have evaluated a range of carbon-based materials to solve this challenge. Standard graphite materials have a dramatically lower thermal conductivity of 117 W/mK to 165 W/mK compared to copper at 350 W/mK to 400 W/mK. Graphene or diamond exhibits a significantly higher thermal conductivity, higher than that of any other material used.
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Shin-Etsu Chemical Co., Ltd. (Head Office: Tokyo, President: Yasuhiko Saitoh) has developed innovative silicone thermal interface materials for applications in electric vehicles (EV) and hybrid electric vehicles (HEV).
With the electrification of automobiles, the demand for heat dissipation measures for lithium-ion batteries and for various other electronic control systems are increasingly becoming more sophisticated and diversified. With the accelerating worldwide growth in vehicle electrification, the amount of thermal interface materials in automotive parts has increased and their applications are expanding. In response to this changing market environment, Shin-Etsu Chemical has developed two kinds of new products with unique characteristics:
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The TC-PEN Series, which features a distinctly reduced density, soft thermal interface pad that can meet the demand for a high level for EV and HEV applications,